Sika SG20S structural sealant

Quick info

Comply with GB 16776-2005, ASTM C 1184&ASTM C920 for Type S, Grade NS, Grade 25 (displacement capacity ± 25%)

Very good UV resistance and weather resistance can be effectively adhered to many substrates, including glass, metal, coated metal, plastic and wood

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FURTHER VALUES SEE SAFETY DATA SHEET

Chemical composition Single component organosilicon
Color (CQP001-1) Black
Curing rate Moisture curing
Density (not hardened before) 1.41 kg/l

Temperature applied

5 ─ 40 °C
Table dry time (CQP019-1) 25 Minutes
Finger touch time (CQP019-3) 150 minutes
Shore hardness A (CQP023-1/ISO 48-4) 47
Tensile strength (CQP036-1/ISO 527) 2.1 MPa
Elastic modulus at 100% elongation (CQP036-1/ISO 37) 0.6 MPa
Elongation at break (CQP036-1/ISO 37) 700 %
Crack tear diffusion resistance (CQP045-1/ISO 34) 12 N/mm
Service temperature -40 ─ 150 °C
Best shelf life (CQP016-1) 12 months

Description

Sikasil ® SG-20S is a one-component neutral curing organic silicon adhesive for structural glass, which can effectively adhere to a variety of substrates

Product advantages

Comply with GB 16776-2005, ASTM C 1184&ASTM C920 for Type S, Grade NS, Grade 25 (displacement capacity ± 25%)

Very good UV resistance and weather resistance can be effectively adhered to many substrates, including glass, metal, coated metal, plastic and wood

Scope of application

Sikasil ® SG-20S is used for structural glass and other adhesive construction.

This product is only applicable to experienced professional users. The actual substrate and conditions must be tested to ensure adhesion and material compatibility.

Curing rate

Sikasil ® SG-20 S reacts with moisture in the atmosphere to solidify. At low temperature, the moisture in the air is usually low, and the curing reaction rate is slightly slow (see Figure 1)

Construction method

Surface finishing

The surface shall be clean, dry and free of grease, oil and dust.

The surface treatment depends on the specific properties of the substrate and will affect the adhesion durability.

Construction

The optimum temperature of base material and sealant is between 15 ° C and 25 ° C.

Sikasil ® SG-20 can be processed with manual, pneumatic or electric glue gun and pump equipment. For suggestions on selecting and setting up the appropriate pump system, please contact Sika Industrial Systems Engineering.

The joint must be of proper size.

The calculation of necessary joint size is based on the technical data of adhesive and adjacent building materials, the exposure degree of building components, their structure and size, and external loads.

The joint depth shall not exceed 15 mm

The finishing and completion must be carried out within the molding time of the sealant or adhesive.

Modified Sikasil ® For SG-20S adhesive surface, in order to achieve better wetting effect, the adhesive can be extruded without using mold agent.

Packaging method                            600ml sausage package

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